Fully Automatic Wafer Temporary Bonder
4"-8"/8"-12"wafer application
Automatic support wafer & device wafer bonding
Thinner wafer capability
Opitonal post measuring bonded wafer
Vacuum thermal press bonding
Compatible wafer cassette / wafer box
PC based control with Windows OS
Intelligent wafer mapping in cassette
SECS/GEM or simple link capability
Automatic support wafer & device wafer aligning
For more information, Please contact us.
building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai,China.
302, 3rd Floor, Building B, Kaicheng High tech Park, Dalang Street, Longhua District, Shenzhen, China