Semi Automatic Wafer Detaper
4"~ 8"wafer application
Automatic tape peeling & rewindig
Thinner wafer capability
Manual wafer loading & unloading
Adhesive tape peeling technology
PLC based control
Automatic adhesive tape feeding & taping
Desktop type
For more information, Please contact us.
building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai,China.
302, 3rd Floor, Building B, Kaicheng High tech Park, Dalang Street, Longhua District, Shenzhen, China