Specifications

Be used to 200 to 300 mm wafer

High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer.

Equipped with JEL-developed image sensor, and internal motor driver and controller.

Size, shape, material of spindle can be changed according to the wafer type.

Bernoulli type is also available.

Control: RS232C and parallel photo I/O

Available for non-SEMI standard notch or flat

Optional Z-axis for pick-up/place operation is available.

For more information, Please contact us.